Vacuum Soldering System for R&D and small volume production

The centrotherm VLO 20 vacuum soldering system meets the highest demands of R&D departments as well as the needs of small production facilities which use vacuum to achieve voidless soldering joints.

With VLO 20, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.

This system is ideal for production facilities which run fluxless and voidless soldering processes with various gas atmospheres [N2, H2 100, N2/H2 95/5]. The centrotherm VLO 20 optionally provides chemical activation with HCOOH or dry activation with MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux.

• The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.

   

• Applications：

  • Power Semiconductors
  • Advanced Packaging
  • Hybrid Microelectronic Assemblies
  • Optoelectronic PackagingHermetic Package Sealing
  • Wafer Level Packaging
  • UHB LED Packaging
  • MEMS Package Sealing

   

• Benefits：

  • Process temperature up to 450 °C
  • Excellent temperature uniformity
  • Vacuum level up to 10-5 mbar
  • Very short cycle times
  • centrotherm soldering laboratory for soldering tests
  • Remote access for service