Vacuum Soldering System for Advanced Packaging and R&D
The centrotherm VLO 6 and VLO 12 vacuum soldering systems have been designed for Advanced Packaging and Power Semiconductor applications and achieve very high heating and cooling rates. The systems meet the highest demands of start-ups and R&D departments which use vacuum to achieve voidless soldering joints.
VLO 6 | VLO 12 is the small-size entry level system of the centrotherm VLO family yet offering the full functionality like the other VLOs. With the VLO 6 | VLO 12, the soldered area affected by voids can be reduced to less than 2%, typical reflow soldering systems range at 20%.
This system is ideally suited for production facilities and start-ups which run fluxless and voidless soldering processes with various gas atmospheres [N2, H2 100, N2/H2 95/5]. The centrotherm VLO 6 | VLO 12 optionally provides chemical activation with HCOOH or dry activation with MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux. |
